Company / HQ
Infineon Technologies — Neubiberg (near Munich), Germany.
Offering
Automotive-grade HybridPACK™ Drive G2 power modules (SiC + Si options) and EiceDRIVER™ isolated gate-driver ICs optimized for SiC traction inverters; first customer products built on Infineon’s 200 mm SiC wafer technology.
Project summary & timeline
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Design-win: Infineon secured a design-win to supply SiC and silicon HybridPACK™ Drive G2 modules for Rivian’s R2 traction-inverter platform, with series deliveries targeted from 2026.
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Manufacturing milestone: Advanced its 200-mm SiC roadmap and delivered the first customer products built on 200-mm SiC wafers in Q1 2025 from its Villach facility.
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Supporting products: Released new EiceDRIVER™ isolated gate drivers in 2025 to match SiC switching requirements and simplify OEM integration.
Implementation steps
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Qualified HybridPACK™ Drive G2 modules for automotive traction use against OEM and AEC-Q standards.
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Brought 200-mm SiC wafer processing online to improve cost structure and throughput.
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Introduced matching gate-driver family and reference designs to shorten customer qualification cycles.
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Coordinated pilot, PPAP, and SOP milestones with Rivian to align series-production timing.
Technical & commercial benefits
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System-level: SiC modules enabled higher efficiency, higher switching frequency, and improved inverter power density compared to traditional IGBTs.
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OEM integration: Pre-qualified modules and drivers reduced engineering time, allowing Rivian to accelerate product launch.
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Economics: 200-mm SiC wafers improved unit economics compared with smaller wafers, lowering cost per device.
Protectional / resilience measures
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Vertical investments in 200-mm SiC wafer production and in-house module assembly reduced external supply risks.
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Automotive-grade qualification provided reliability assurance to OEMs.
Outcome/market impact
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The Rivian R2 design-win positioned Infineon to capture multi-year traction module volumes starting 2026.
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Helped shift SiC adoption from premium EVs toward mainstream models by improving availability and reducing cost trajectory.
Financial after implementation
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The program created new revenue visibility through confirmed design-wins and secured mid-term growth via large EV supply contracts.
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Infineon’s SiC roadmap and HybridPACK product ramp became a key growth driver in its 2025 power-semiconductor business, strengthening its competitive position in automotive markets.
Key risks & lessons
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Risk: Delays in wafer yield improvements or module assembly could affect customer program timelines.
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Lesson: Early scaling of wafer and module capacity, combined with turnkey solutions (modules + gate drivers), is essential to secure OEM confidence and long-term contracts.