Semiconductor Packaging

Background The semiconductor industry has rapidly shifted from traditional packaging methods (like wire bonding and flip-chip) to advanced forms such as 2.5D/3D integration, fan-out wafer-level packaging, and heterogeneous integration. While much attention is given to silicon, interposers, and interconnects, the “soft side” of packaging — polymer-based materials like underfills, die attach adhesives, encapsulants, mold compounds, […]