Glass Interposers Market Companies
- Corning Incorporated
- AGC Inc. (Asahi Glass)
- SCHOTT AG
- Plan Optik AG
- Kiso Micro Co., Ltd.
- Ushio Inc.
- 3D Glass Solutions, Inc.
- Triton Microtechnologies, Inc.
- Taiwan Semiconductor Manufacturing Company (TSMC)
- Murata Manufacturing Co., Ltd.
- Dai Nippon Printing Co., Ltd.
- RENA (Glass interposer provider)
- Samtec Inc.
- Workshop of Photonics
- TECNISCO, LTD.
- Ohara Corporation
- Nippon Electric Glass (NEG)
- Entegris
Corning Incorporated
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Headquarters: Corning, New York, USA
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Product Offerings: Specialty glass carriers and substrates designed for semiconductor packaging, including glass interposers with advanced through-glass via (TGV) technology to reduce warp and enable fine pitch interconnects.
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Market Share & Revenue: Corning is a leading player in the glass interposers market with major advances in glass substrate quality, enabling scalability for wafer and panel sizes. Exact revenue from glass interposers is not publicly disclosed.
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Recent Developments: Launched innovation programs for ultra-flat glass panels targeting AI chipsets and cloud computing applications; advanced TGV process reducing via sizes to 25 µm.
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Competitive Positioning: Positioned as a technology leader with strong R&D capabilities and partnerships with top semiconductor foundries.
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Key Customers/Industries: High-performance computing, AI, 5G, cloud infrastructure.
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Financial Performance: Corning is a publicly listed company with diversified product lines; reported strong growth through advanced packaging solutions.
AGC Inc. (Asahi Glass)
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Headquarters: Tokyo, Japan
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Product Offerings: High-precision thin glass substrates with through-glass vias (TGV) for 3D integration in semiconductor packaging. Supports wafer and panel sizes with excellent flatness and thermal expansion matching.
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Market Share & Revenue: A key market contributor with robust manufacturing scale; specific segment revenue not publicly detailed.
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Recent Developments: Introduced ultra-thin 30 μm glass substrates with embedded passive components optimized for AR/MR and consumer electronics.
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Competitive Positioning: Strong manufacturing ability with customized TGV solutions enabling high integration density.
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Key Customers/Industries: Mobile devices, telecommunications, automotive electronics.
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Financial Performance: AGC is a large diversified materials company, consistent investment in expanding glass interposer capabilities.
SCHOTT AG
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Headquarters: Mainz, Germany
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Product Offerings: Highly engineered glass wafers and panels optimized for advanced packaging with TGVs, including FLEXINITY® connect structured glass for semiconductor chip packaging.
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Market Share & Revenue: Prominent market player, especially in European and Asian markets, though exact revenue from interposers is not public.
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Recent Developments: Launched FLEXINITY® connect ultra-fine structured glass for advanced packaging with enhanced thermal and electrical performance.
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Competitive Positioning: Innovation-driven with strong specialty glass technology enabling high-frequency signal transmission and thermal stability.
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Key Customers/Industries: AI, data centers, telecommunications (5G), mobile and IoT applications.
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Financial Performance: SCHOTT is a privately held tech group with significant investment in specialty glass innovation.
Plan Optik AG
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Headquarters: Elsoff, Germany
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Product Offerings: Structured wafers including borosilicate, quartz, fused silica glass wafers and glass interposers with through-glass vias and redistribution layers.
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Market Share & Revenue: Recognized supplier in the glass interposer space with a niche presence; financials not publicly disclosed. The company went public on the Frankfurt Stock Exchange in 2024.
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Recent Developments: Expanded manufacturing capabilities to include photolithographically patterned glass interposers targeting 2.5D semiconductor packaging.
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Competitive Positioning: Known for precision microfabrication and strong presence in European and Asian chip assembly markets.
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Key Customers/Industries: Consumer electronics, automotive, aerospace, pharmaceutical, and chemical industries.
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Financial Performance: Mid-sized company with focused product line and investment in growth.
Kiso Micro Co., Ltd.
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Headquarters: Japan
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Product Offerings: Ultra-thin glass interposers and precision microfabrication for high-density semiconductor packaging.
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Market Share & Revenue: Listed among leading manufacturers in the glass interposers market; specific financial data not publicly available.
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Recent Developments: Engaged in innovative glass interposer development with growing adoption in the semiconductor supply chain.
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Competitive Positioning: Specialist in ultra-thin, high-precision glass substrates.
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Key Customers/Industries: Semiconductor packaging, advanced ICs.
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Financial Performance: Private company with active R&D focus.
Ushio Inc.
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Headquarters: Tokyo, Japan
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Product Offerings: Optical and semiconductor manufacturing equipment, including lithography tools for 2.5D and 3D glass and organic interposers.
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Market Share & Revenue: Equipment and technology provider critical to glass interposer manufacturing; direct revenue contribution from interposers unspecified.
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Recent Developments: Installed projection aligner systems for glass interposer development; active in research consortia for next-gen packaging.
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Competitive Positioning: Supplier of advanced lithography equipment enabling fine patterning on glass substrates.
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Key Customers/Industries: Semiconductor fabs, packaging houses.
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Financial Performance: A major supplier in optical and semiconductor equipment markets.
3D Glass Solutions, Inc.
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Headquarters: Not publicly specified (USA-based)
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Product Offerings: Focused on glass-based RF and microwave interposer technology for advanced semiconductor packaging.
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Market Share & Revenue: Recognized innovator in the niche of glass interposers for RF applications; detailed financials not disclosed.
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Recent Developments: Developing custom glass interposer solutions integrating RF and microwave technology.
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Competitive Positioning: Niche technology provider with specialized product focus.
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Key Customers/Industries: RF, microwave semiconductor packaging.
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Financial Performance: Private company with targeted growth strategy.
Triton Microtechnologies, Inc.
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Headquarters: Carlsbad, California, USA
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Product Offerings: Ultra-thin through-glass-via (TGV) interposers for high-density IC packaging supporting 2.5D and 3D integration.
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Market Share & Revenue: Positioned as a start-up innovator with backing from AGC and nMode; revenues growing alongside production capacity expansion.
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Recent Developments: Raised $3.2 million for plant expansion; manufacturing advanced TGV interposers with via diameters down to 70 microns.
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Competitive Positioning: Technology-driven company bridging niche interposer and advanced packaging innovation.
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Key Customers/Industries: MEMS, RF, optics, high-density IC markets.
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Financial Performance: Privately funded start-up with recent capital infusion.
Dai Nippon Printing Co., Ltd. (DNP)
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Headquarters: Tokyo, Japan
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Product Offerings: Glass Core Substrates and high-performance interposers for next-gen semiconductor packages including TGV substrates.
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Market Share & Revenue: A key emerging player in interposer technology advancing mass production; exact revenue data unavailable.
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Recent Developments: Developed glass interposer with high-density TGV and entered a consortium (JOINT2) targeting mass production by 2024.
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Competitive Positioning: Strong in microfabrication and printing-based nanoimprint lithography technologies.
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Key Customers/Industries: Semiconductor packaging, AI processors, 5G systems.
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Financial Performance: Large printer and electronic components provider with diversified portfolio.
RENA
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Headquarters: Switzerland
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Product Offerings: Provides glass interposer substrates using precision laser and etching technology for TGVs; manufacture blind and through vias.
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Market Share & Revenue: Specialized supplier in laser-processed glass interposers; financial details not public.
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Recent Developments: Focus on high aspect ratio vias and scalable manufacturing processes.
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Competitive Positioning: Precision glass processing technology with advanced laser-induced etching.
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Key Customers/Industries: Semiconductor packaging.
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Financial Performance: Privately held with focus on high-tech materials.
Samtec Inc.
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Headquarters: New Albany, Indiana, USA
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Product Offerings: High-speed interconnects and glass core technology including glass interposers, smart glass substrates, microstructured glass substrates.
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Market Share & Revenue: Significant technology investor in glass interposer processing systems; partnering with leading OSAT providers.
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Recent Developments: Recently ordered advanced wafer processing equipment (ClassOne Solstice S8) for glass core products to scale manufacturing.
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Competitive Positioning: Strong in connector and interconnect solutions integrated with glass interposer technologies.
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Key Customers/Industries: Networking, server, high-bandwidth applications.
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Financial Performance: Privately held but major player in electronics interconnect industry.
Workshop of Photonics (WoP)
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Headquarters: Vilnius, Lithuania
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Product Offerings: Glass spacers and interposers suited for 2.5D/3D integration and wafer-level bonding with semiconductor substrates.
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Recent Developments: Offering high surface quality glass wafers with dense through holes and rapid prototyping for custom designs.
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Competitive Positioning: Focus on precision laser micromachining and high-quality production services.
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Key Customers/Industries: MEMS, sensors, analytical chips.
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Financial Performance: Small to mid-size company with specialized niche in glass interposers.
TECNISCO, LTD.
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Headquarters: Japan
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Product Offerings: Glass wafers for MEMS devices, microfluidic glass products, and other specialty glass components.
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Competitive Positioning: Supplier of glass for advanced sensor and actuator applications possibly linked to interposers.
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Financial Performance: Private company with niche focus in glass materials.
Ohara Corporation
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Headquarters: Sagamihara, Japan
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Product Offerings: Optical glass, polished substrates, fused silica, quartz, low expansion glass, and other advanced glass products.
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Market Share & Revenue: Large specialty glass manufacturer supplying diverse industries; relevant for glass interposer substrates.
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Competitive Positioning: Established global supplier of high-performance specialty glass with strong industry presence.
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Financial Performance: Established since 1935, privately held company with robust sales in optical and specialty glass sectors.
Nippon Electric Glass (NEG)
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Headquarters: Japan
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Product Offerings: Optical glass, electronic glass materials including glass substrates for advanced electronic components.
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Market Position: One of Japan’s leading glass manufacturers contributing to the glass substrate industry.
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Financials: Not specifically reported for interposers; part of broader specialty glass business.
Entegris
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Headquarters: Billerica, Massachusetts, USA
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Product Offerings: Materials and components for semiconductor manufacturing, including ultra-pure materials that may support glass interposer fabrication.
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Competitive Positioning: Materials solutions provider with growing focus on next-gen semiconductor packaging technologies.
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Financials: Public company with diversified semiconductor materials business.
Taiwan Semiconductor Manufacturing Company (TSMC)
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Headquarters: Hsinchu, Taiwan
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Product Offerings: Leading semiconductor foundry with active development and partnership in glass interposer technology for advanced packaging.
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Competitive Positioning: Market leader in semiconductor manufacturing incorporating advanced packaging and interposer solutions.
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Key Customers/Industries: Broad semiconductor customers, including AI, HPC, mobile.
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Financial Performance: Largest semiconductor foundry globally with strong revenue growth and R&D investment.
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